Modern chips, which are becoming increasingly complex and integrated, are gradually propelling the entire semiconductor industry forward, making chip quality and related technological breakthroughs imperative, said a chip expert.
Wang Xiaoyin, a core engineer from Teradyne China Design Center, said by incorporating advanced technologies, chip testing hardware design is becoming a critical link in ensuring chip quality and driving technological breakthroughs.
“The design of testing hardware must not only capture performance metrics with precision, but also continuously innovate in areas such as testing speed, data transmission and interface compatibility,” Wang said.
Wang stressed that with the rapid development of cutting-edge technologies such as artificial intelligence, big data and high-performance computing, chip testing hardware design is facing unprecedented opportunities.
Advancements in testing hardware can enable higher precision and efficiency across the semiconductor industry, Wang said, noting that technological innovations in power electronics, such as Mitsubishi’s trench-gate technology for IGBT (Insulated Gate Bipolar Transistor) modules, are driving progress in energy-efficient applications like electric vehicles.
Similarly, breakthroughs in key technical challenges, such as power control, interface board design and AI technology integration, are crucial to ensuring efficient and reliable chip testing, Wang said, citing Teradyne China Design Center’s leading role in several major projects that contribute to advancements in high-performance computing chips, network chip testing and electric vehicle manufacturing.
Wang noted that with the further integration of emerging technologies, test hardware design has become a key force driving the continuous progress of the entire semiconductor industry in the future.
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